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 Failure times of silicon wafer microchips. Refer to the National Semiconductor experiment with tin-lead solder bumps used to manufacture silicon wafer integrated circuit chips

Recall that the failure times of the microchips (in hours) was determined at different solder temperatures (degrees Centigrade). The data are reproduced in the table. The researchers want to predict failure time ( ) based on solder tempe- y rature ( x ) using the quadratic model, y = β0 +β1x +β2×2 . First, demonstrate, the potential for extreme round-off errors in the parameter estimates for this model. Then, propose and fit an alternative model to the data, one that should greatly reduce the round-off error problem

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